Technology | 0.6 micron CMOS | 0.5 micron CMOS process |
Die Size | 10.95mm x 10.95mm | 8.6mm x 8.6mm (74mm^2) |
Transistors | 2.8 mil - 1 mil for logic | 2.8 mil - 1 mil for logic |
Cache | 32K Unified | 32K Unified |
Temp. Range | 0 to 85 degrees C | 0 to 85 degrees C |
Performance | 60+ SPECint92 @ 66MHz 80+ SPECfp92 @ 66MHz 85 SPECint92 @ 80MHz 105 SPECfp92 @ 80MHz | 105 SPECint92 @ 100MHz (est.) 125 SPECfp92 @ 100MHz (est.) |
Signal I/Os | 184 | 184 |
Power Supply | 3.6V ▒5% | 5.0V▒5% & 2.5V▒.2V or 3.3V▒5% & 2.5V▒.2V |
Power Dissipation | 5.6W @ 50MHz 7.0W @ 66MHz 8.0W @ 80MHz | 4W @ 100MHz |
Packaging | Ceramic quad flat pack (304 pins) | Ceramic quad flat pack (304 pins) |