PowerPC Chip: 604 620
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Technology: 0.5 micron CMOS process 0.5 micron CMOS process
Die Size: 12.4mm x 15.8mm (196mm^2) 17.1mm x 18.2mm (311mm^2)
Transistors: 3.6 million 7 million
(1.5 million for logic)
Cache: 32K Split 64K Split
Temp. Range: Not Available Not Available
Performance: 160 SPECint92 @ 100MHz(proj) 225 SPECint92 @ 133MHz(est)
165 SPECfp92 @ 100MHz(proj) 300 SPECfp92 @ 133MHz(est)
Signal I/Os: 171 482
Power Supply: 3.3V 3.3V▒0.3V
Power
Dissipation: <10W @ 100MHz (est) 30W @ 133MHz
Packaging: Ceramic quad flat pack 25 x 25 Ball Grid Array
(256 pins)